Stéphane Moreau

Orcid: 0000-0001-6104-2050

According to our database1, Stéphane Moreau authored at least 21 papers between 2002 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects.
Proceedings of the 2024 International Symposium on Physical Design, 2024

Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023
Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution.
Proceedings of the 2023 International Symposium on Physical Design, 2023

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021
Effects of Boundary Conditions in Fully Convolutional Networks for Learning Spatio-Temporal Dynamics.
Proceedings of the Machine Learning and Knowledge Discovery in Databases. Applied Data Science Track, 2021

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.
Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2018
Numerical analysis of a high-order unstructured overset grid method for compressible LES of turbomachinery.
J. Comput. Phys., 2018

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016

2015
Spectral recycling strategies for the solution of nonlinear eigenproblems in thermoacoustics.
Numer. Linear Algebra Appl., 2015

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.
Microelectron. Reliab., 2015

2014
An overset grid method for large eddy simulation of turbomachinery stages.
J. Comput. Phys., 2014

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO<sub>2</sub> direct hybrid bonding.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.
Microelectron. Reliab., 2013

A new experimental methodology using point deflection to quantify residual stress of thin polymer membrane materials in MEMS devices.
Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

Chip to wafer copper direct bonding electrical characterization and thermal cycling.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011
200°C direct bonding copper interconnects : Electrical results and reliability.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2005
MetaSurv: Web-Platform Generator for the Monitoring of Health Indicators and Interactive Geographical Information System.
Proceedings of the Connecting Medical Informatics and Bio-Informatics - Proceedings of MIE 2005, 2005

2004
Comparative study of thermal cycling and thermal shocks tests on electronic components reliability.
Microelectron. Reliab., 2004

2002
Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2.
Microelectron. Reliab., 2002


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