Steffen Wiese

According to our database, Steffen Wiese authored at least 8 papers between 2004 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

Experimental determination of the Young's modulus of copper and solder materials for electronic packaging.

Frank Kraemer, Mike Roellig, René Metasch, Joseph Al Ahmar, Karsten Meier, Steffen Wiese

Microelectron. Reliab., 2018

2015

Assessment of long term reliability of photovoltaic glass-glass modules vs. glass-back sheet modules subjected to temperature cycles by FE-analysis.

Frank Kraemer, Steffen Wiese

Microelectron. Reliab., 2015

2013

Mechanical problems of novel back contact solar modules.

Frank Kraemer, Steffen Wiese, Erik Peter, Jonas Seib

Microelectron. Reliab., 2013

2008

The effect of downscaling the dimensions of solder interconnects on their creep properties.

Steffen Wiese, Mike Roellig, Maik Mueller, Klaus-Jürgen Wolter

Microelectron. Reliab., 2008

2007

Creep of thermally aged SnAgCu-solder joints.

Steffen Wiese, Klaus-Jürgen Wolter

Microelectron. Reliab., 2007

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.

Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel

Microelectron. Reliab., 2007

2004

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders.

Steffen Wiese, Klaus-Jürgen Wolter

Microelectron. Reliab., 2004

Time-independent elastic-plastic behaviour of solder materials.

Steffen Wiese, Sven Rzepka

Microelectron. Reliab., 2004