Srinivasan Gopal

According to our database, Srinivasan Gopal authored at least 15 papers between 2009 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

Diagnosis of Inter-Turn Shorts of Loaded Transformer Under Various Load Currents and Power Factors; Impulse Voltage-Based Frequency Response Approach.

Natarajan Shanmugam, Srinivasan Gopal, Balasubramanian Madanmohan, S. P. Balaji, Rajesh Rajamani

IEEE Access, 2021

A Reconfigurable Asynchronous SERDES for Heterogenous Chiplet Interconnects.

Jainaveen Sundaram, Srinivasan Gopal, Thomas P. Thomas, Edward Burton, Erika Ramirez

Proceedings of the 22nd International Symposium on Quality Electronic Design, 2021

Trends and Opportunities for SRAM Based In-Memory and Near-Memory Computation.

Srivatsa Srinivasa, Akshay Krishna Ramanathan, Jainaveen Sundaram, Dileep Kurian, Srinivasan Gopal, Nilesh Jain, Anuradha Srinivasan, Ravi R. Iyer, Vijaykrishnan Narayanan, Tanay Karnik

Proceedings of the 22nd International Symposium on Quality Electronic Design, 2021

2020

A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC.

Srinivasan Gopal, Sourav Das, Partha Pratim Pande, Deukhyoun Heo

IEEE Trans. Circuits Syst., 2020

Making a Case for Partially Connected 3D NoC: NFIC versus TSV.

Aqeeb Iqbal Arka, Srinivasan Gopal, Janardhan Rao Doppa, Deukhyoun Heo, Partha Pratim Pande

ACM J. Emerg. Technol. Comput. Syst., 2020

2019

Analysis of Systematic Losses in Hybrid Envelope Tracking Modulators.

Luke Renaud, Joe Baylon, Srinivasan Gopal, Md. Aminul Hoque, Deukhyoun Heo

IEEE Trans. Circuits Syst. I Regul. Pap., 2019

A 25-35 GHz Neutralized Continuous Class-F CMOS Power Amplifier for 5G Mobile Communications Achieving 26% Modulation PAE at 1.5 Gb/s and 46.4% Peak PAE.

Sheikh Nijam Ali, Pawan Agarwal, Srinivasan Gopal, Shahriar Mirabbasi, Deukhyoun Heo

IEEE Trans. Circuits Syst. I Regul. Pap., 2019

Hierarchical Design Methodology and Optimization for Proximity Communication based Contactless 3D ThruChip Interface.

Srinivasan Gopal, Deukhyoun Heo, Tanay Karnik

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

High-Performance and Small-Form Factor Near-Field Inductive Coupling for 3-D NoC.

Srinivasan Gopal, Sourav Das, Pawan Agarwal, Sheikh Nijam Ali, Deukhyoun Heo, Partha Pratim Pande

IEEE Trans. Very Large Scale Integr. Syst., 2018

A 16-Gb/s Low-Power Inductorless Wideband Gain-Boosted Baseband Amplifier With Skewed Differential Topology for Wireless Network-on-Chip.

Joe Baylon, Xinmin Yu, Srinivasan Gopal, Reza Molavi, Shahriar Mirabbasi, Partha Pratim Pande, Deukhyoun Heo

IEEE Trans. Very Large Scale Integr. Syst., 2018

A Spatial Multi-Bit Sub-1-V Time-Domain Matrix Multiplier Interface for Approximate Computing in 65-nm CMOS.

Srinivasan Gopal, Pawan Agarwal, Joe Baylon, Luke Renaud, Sheikh Nijam Ali, Partha Pratim Pande, Deukhyoun Heo

IEEE J. Emerg. Sel. Topics Circuits Syst., 2018

A 28GHz 41%-PAE linear CMOS power amplifier using a transformer-based AM-PM distortion-correction technique for 5G phased arrays.

Sheikh Nijam Ali, Pawan Agarwal, Joe Baylon, Srinivasan Gopal, Luke Renaud, Deukhyoun Heo

Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

2017

Energy and Area Efficient Near Field Inductive Coupling: A Case Study on 3D NoC.

Srinivasan Gopal, Sourav Das, Deukhyoun Heo, Partha Pratim Pande

Proceedings of the Eleventh IEEE/ACM International Symposium on Networks-on-Chip, 2017

Energy-efficient and robust 3D NoCs with contactless vertical links (Invited paper).

Sourav Das, Srinivasan Gopal, Deukhyoun Heo, Partha Pratim Pande

Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017

2009

Inducing Chaos in MOSFET-Based Electronic Circuits.

Srinivasan Gopal, Ying-Cheng Lai

Circuits Syst. Signal Process., 2009