Sophie Verrun
According to our database1,
Sophie Verrun
authored at least 3 papers
in 2009.
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Bibliography
2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
Proceedings of the IEEE International Conference on 3D System Integration, 2009