Soon-Wook Kim

According to our database1, Soon-Wook Kim authored at least 2 papers between 2015 and 2019.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2019
Process Complexity and Cost Considerations of Multi-Layer Die Stacks.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015


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