Soon-Bok Lee

According to our database, Soon-Bok Lee authored at least 4 papers between 2006 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2012

Chip warpage model for reliability prediction of delamination failures.

Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee

Microelectron. Reliab., 2012

A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages.

Kyung-Woon Jang, Jin-Hyoung Park, Soon-Bok Lee, Kyung-Wook Paik

Microelectron. Reliab., 2012

2007

An Approach to Analyzing Commonality and Variability of Features using Ontology in a Software Product Line Engineering.

Soon-Bok Lee, Jin-Woo Kim, Chee-Yang Song, Doo-Kwon Baik

Proceedings of the 5th ACIS International Conference on Software Engineering Research, 2007

2006

Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages.

Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik

Microelectron. Reliab., 2006