Simon Gousseau

According to our database, Simon Gousseau authored at least 2 papers between 2015 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.

Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün

Microelectron. Reliab., 2015