Shuji Tanaka

Orcid: 0000-0002-2663-3266

According to our database1, Shuji Tanaka authored at least 34 papers between 2003 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Awards

IEEE Fellow

IEEE Fellow 2018, "For contributions to micro-electromechanical systems for acoustic wave devices, physical sensors, and".

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
A Two-Axis Orthogonal Resonator for Variable Sensitivity Mode Localization Sensing.
Sensors, July, 2024

2023
Multi-Ring Disk Resonator with Elliptic Spokes for Frequency-Modulated Gyroscope.
Sensors, March, 2023

2022
Monolithic Fabrication of Film Bulk Acoustic Resonators above Integrated Circuit by Adhesive- Bonding-Based Film Transfer.
Dataset, May, 2022

2021
Dual-Mass Resonator with Dynamically Balanced Structure for Roll/Pitch Rate Integrating Gyroscope.
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021

Frequency and Quality Factor Matched 2-Axis Dual Mass Resonator.
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021

2020
Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots.
J. Robotics Mechatronics, 2020

Special Issue on MEMS for Robotics and Mechatronics.
J. Robotics Mechatronics, 2020

Commercial Production of Low-k PZT film using Sputtering Method.
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020

2018
Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors.
Sensors, 2018

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin.
Sensors, 2018

Wireless Sensor Chip Platform Using On-Chip Electrochromic Micro Display.
IEICE Trans. Electron., 2018

2017
A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications.
Sensors, 2017

3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer.
Sensors, 2017

A 1.9GHz Low-Phase-Noise Complementary Cross-Coupled FBAR-VCO without Additional Voltage Headroom in 0.18µm CMOS Technology.
IEICE Trans. Electron., 2017

System development of biosensing module using CMOS hall sensor array for disposable wireless diagnosis device.
Proceedings of the 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2017

2016
Stacked Integration of MEMS on LSI.
Micromachines, 2016

Plasma half dicing based on micro-loading effect for ultra-thin LiNbO3 plate wave devices on Si substrate.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016

Letter from the general chair.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016

A multiple sensor platform with dedicated CMOS-LSIs for robot applications.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016

Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016

Electroplating of neodymium iron alloys.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016

Lamb wave resonators and resonator filters in periodical poled Z-cut LiTaO3 plate.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016

Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016

A1 mode Lamb wave on thin LiTaO3 for high frequency acoustic devices.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016

2015
Delay window blind oversampling clock and data recovery algorithm with wide tracking range.
Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015

2014
Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues.
Microelectron. Reliab., 2014

Automatic identification of lung candidate nodules on chest CT images based on temporal subtraction images.
Proceedings of the 2014 Joint 7th International Conference on Soft Computing and Intelligent Systems (SCIS) and 15th International Symposium on Advanced Intelligent Systems (ISIS), 2014

2013
The methods of maintaining Low frequency stability in FBAR based cross-coupled VCO design.
IEICE Electron. Express, 2013

A low phase noise FBAR based multiband VCO design.
IEICE Electron. Express, 2013

2011
Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS.
Microelectron. Reliab., 2011

2007
A matched expansion MEMS probe card with low CTE LTCC substrate.
Proceedings of the 2007 IEEE International Test Conference, 2007

2005
Monte Carlo grid for financial risk management.
Future Gener. Comput. Syst., 2005

2004
Vacuum test of a micro-solid propellant rocket array thruster.
IEICE Electron. Express, 2004

2003
Deep Structures Wet Etched Into Lithium Niobate Using A Physical Mask.
Int. J. Comput. Eng. Sci., 2003


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