Shuji Tanaka
Orcid: 0000-0002-2663-3266
According to our database1,
Shuji Tanaka
authored at least 34 papers
between 2003 and 2024.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 2018, "For contributions to micro-electromechanical systems for acoustic wave devices, physical sensors, and".
Timeline
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On csauthors.net:
Bibliography
2024
Sensors, July, 2024
2023
Sensors, March, 2023
2022
Monolithic Fabrication of Film Bulk Acoustic Resonators above Integrated Circuit by Adhesive- Bonding-Based Film Transfer.
Dataset, May, 2022
2021
Dual-Mass Resonator with Dynamically Balanced Structure for Roll/Pitch Rate Integrating Gyroscope.
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021
2020
Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots.
J. Robotics Mechatronics, 2020
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020
2018
Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors.
Sensors, 2018
Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin.
Sensors, 2018
IEICE Trans. Electron., 2018
2017
A Tactile Sensor Network System Using a Multiple Sensor Platform with a Dedicated CMOS-LSI for Robot Applications.
Sensors, 2017
3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer.
Sensors, 2017
A 1.9GHz Low-Phase-Noise Complementary Cross-Coupled FBAR-VCO without Additional Voltage Headroom in 0.18µm CMOS Technology.
IEICE Trans. Electron., 2017
System development of biosensing module using CMOS hall sensor array for disposable wireless diagnosis device.
Proceedings of the 12th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2017
2016
Plasma half dicing based on micro-loading effect for ultra-thin LiNbO3 plate wave devices on Si substrate.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps.
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
Proceedings of the 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, 2016
2015
Delay window blind oversampling clock and data recovery algorithm with wide tracking range.
Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015
2014
Microelectron. Reliab., 2014
Automatic identification of lung candidate nodules on chest CT images based on temporal subtraction images.
Proceedings of the 2014 Joint 7th International Conference on Soft Computing and Intelligent Systems (SCIS) and 15th International Symposium on Advanced Intelligent Systems (ISIS), 2014
2013
The methods of maintaining Low frequency stability in FBAR based cross-coupled VCO design.
IEICE Electron. Express, 2013
2011
Microelectron. Reliab., 2011
2007
Proceedings of the 2007 IEEE International Test Conference, 2007
2005
2004
IEICE Electron. Express, 2004
2003
Int. J. Comput. Eng. Sci., 2003