Shoso Shingubara
According to our database1,
Shoso Shingubara
authored at least 7 papers
between 2010 and 2024.
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2024
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2024
Electrochemical Biosensor Using Methylene Blue as an Electrochemical Mediator Coupling with DNA Aptamer.
Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024
TSV Formation Using a Direct CU Electroplating on Electroless Plated Barrier Layer with a Low Resistivity.
Proceedings of the International 3D Systems Integration Conference, 2024
2019
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2015
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2013
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2010
All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers.
Proceedings of the IEEE International Conference on 3D System Integration, 2010