Shoichi Kodama

According to our database, Shoichi Kodama authored at least 3 papers between 2013 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation.

Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama

IEICE Electron. Express, 2015

2014

Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure.

Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Influence of wafer thinning process on backside damage in 3D integration.

Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013