Shinichi Endo
According to our database1,
Shinichi Endo
authored at least 5 papers
between 2017 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
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2024
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Bibliography
2024
Direct Sputtered Copper Seed Layer Formation on Low Dielectric Resin to Reduce Transmission Loss.
Proceedings of the International 3D Systems Integration Conference, 2024
Proceedings of the International 3D Systems Integration Conference, 2024
2023
Impacts of Handcrafting Tangible Communication Avatars on the Communication Partners and Creative Experiences.
EAI Endorsed Trans. Creative Technol., 2023
2018
Realizing Loose Communication with Tangible Avatar to Facilitate Recipient's Imagination.
Inf., 2018
2017
Proceedings of the IEEE 6th Global Conference on Consumer Electronics, 2017