Shin-Young Chung

According to our database, Shin-Young Chung authored at least 15 papers between 2019 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Hot-Carrier-Degradation Characterization for Accurate End-of-Life Prediction with 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FET.

Seongkyung Kim, Junkyo Jeong, Eunyu Choi, Jinyoung Kim, Hyewon Shim, Shin-Young Chung, Paul Jung

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Impacts of Post-Cu CMP Queue Time on Reliability.

Yinghong Zhao, Hokyung Park, Ki-Don Lee, Liangshan Chen, Manisha Sharma, Sugento Huandra, Hanson Mao, Brian Filemyr Smith, Wei Xia, Joonah Yoon, Junehwan Kim, Myungsoo Yeo, Shin-Young Chung, Ju Kwang Kim

Proceedings of the IEEE International Reliability Physics Symposium, 2024

Comprehensive Study of SER in FDSOI-Planar: 28 nm to 18 nm Scaling Effect and Temperature Dependence.

Taiki Uemura, Byungjin Chung, Jaehee Choi, Seungbae Lee, Shin-Young Chung, Yuchul Hwang, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2024

Soft-Error Sensitivity in SRAM Manufactured by Bulk Gate-All-Around (GAA) Technology.

Taiki Uemura, Byungjin Chung, Jaehee Choi, Seungbae Lee, Shin-Young Chung, Yuchul Hwang, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2024

A Systematic Study of HCI Improvement in FinFET with Source/Drain Implant and Geometry Modulation.

Rakesh Ranjan, Pavitra R. Perepa, Ki-Don Lee, Ashish Kumar Jha, Kartika C. Sahoo, Kayla N. Sanders, Robert Moeller, Prateek Sharma, Minhyo Kang, Peter Kim, Kwanjae Song, Yongwoo Jeon, Seungho Kim, Hyewon Shim, Shin-Young Chung, Ju Kwang Kim

Proceedings of the IEEE International Reliability Physics Symposium, 2024

An Analysis of CDM-induced BTI-like Degradation using VF-TLP in Advanced FinFET Technology.

Sangmin Oh, Taeyoung Jeong, Junghwan Yum, Minhyuk Lim, Yoohwan Kim, Bongyong Jeong, Jeongmin Jo, Hyewon Shim, Shin-Young Chung, Paul Jung

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023

Impact of Design and Process on Alpha-Induced SER in 4 nm Bulk-FinFET SRAM.

Taiki Uemura, Byungjin Chung, Shin-Young Chung, Seungbae Lee, Yuchul Hwang, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Polarity Dependency of MOL-TDDB in FinFET.

Manisha Sharma, Hokyung Park, Yinghong Zhao, Ki-Don Lee, Liangshan Chen, Joonah Yoon, Rakesh Ranjan, Caleb Dongkyan Kwon, Hyewon Shim, Myungsoo Yeo, Shin-Young Chung, Jon Haefner

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Machine Learning Based V-ramp VBD Predictive Model Using OCD-measured Fab Parameters for Early Detection of MOL Reliability Risk.

SungMan Rhee, Hyunjin Kim, Sangku Park, Taiki Uemura, Yuchul Hwang, Seungjin Choo, Jinju Kim, Hwasung Rhee, Shin-Young Chung

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Impact of Barrier Metal Thickness on SRAM Reliability.

Rakesh Ranjan, Pavitra Ramadevi Perepa, Ki-Don Lee, Hokyung Park, Peter Kim, Ganesh Chakravarthy Yerubandi, Jon Haefner, Caleb Dongkyun Kwon, Minjung Jin, Wenhao Zhou, Hyewon Shim, Shin-Young Chung

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Reliability Assessment of 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FETs.

Seongkyung Kim, Hyerim Park, Eunyu Choi, Young Han Kim, Dahyub Kim, Hyewon Shim, Shin-Young Chung, Paul Jung

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Accelerator-Based Thermal-Neutron Beam by Compact and Low-Cost Moderator for Soft-Error Evaluation in Semiconductor Devices.

Taiki Uemura, Byungjin Chung, Jegon Kim, Hyewon Shim, Shin-Young Chung, Brandon Lee, Jaehee Choi, Shota Ohnishi, Ken Machida

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology.

Taiki Uemura, Byungjin Chung, Jegon Kim, Hyewon Shim, Shin-Young Chung, Brandon Lee, Jaehee Choi, Shota Ohnishi, Ken Machida

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology.

Seongkyung Kim, Ukjin Jung, Seungjin Choo, Kihyun Choi, Tae-Jin Chung, Shin-Young Chung, Euncheol Lee, Juhun Park, Deokhan Bae, Myungyoon Um

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2019

Advanded Design Verification and Debugging Techniques Based on Optical Fault Isolation Method.

Ghil-Geun Oh, Jong-Ho Eun, Shin-Young Chung, Brandon Lee

Proceedings of the 2019 International SoC Design Conference, 2019