Shih-Ying Liu

According to our database1, Shih-Ying Liu authored at least 12 papers between 2011 and 2015.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2015
Closing the Gap between Global and Detailed Placement: Techniques for Improving Routability.
Proceedings of the 2015 Symposium on International Symposium on Physical Design, ISPD 2015, Monterey, CA, USA, March 29, 2015

An approach to anchoring and placing high performance custom digital designs.
Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

2014
Fast Thermal Aware Placement With Accurate Thermal Analysis Based on Green Function.
IEEE Trans. Very Large Scale Integr. Syst., 2014

ACER: An Agglomerative Clustering Based Electrode Addressing and Routing Algorithm for Pin-Constrained EWOD Chips.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014

Planning and placing power clamps for effective CDM protection.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

2013
Agglomerative-based flip-flop merging and relocation for signal wirelength and clock tree optimization.
ACM Trans. Design Autom. Electr. Syst., 2013

Effective power network prototyping via statistical-based clustering and sequential linear programming.
Proceedings of the Design, Automation and Test in Europe, 2013

A network-flow based algorithm for power density mitigation at post-placement stage.
Proceedings of the Design, Automation and Test in Europe, 2013

2012
Hierarchical power network synthesis for multiple power domain designs.
Proceedings of the Thirteenth International Symposium on Quality Electronic Design, 2012

Agglomerative-based flip-flop merging with signal wirelength optimization.
Proceedings of the 2012 Design, Automation & Test in Europe Conference & Exhibition, 2012

A fast thermal aware placement with accurate thermal analysis based on Green function.
Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012

2011
TSV-based 3D-IC placement for timing optimization.
Proceedings of the IEEE 24th International SoC Conference, SOCC 2011, Taipei, Taiwan, 2011


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