Shih-Hsien Wu
Orcid: 0000-0003-3841-8624
According to our database1,
Shih-Hsien Wu
authored at least 2 papers
between 2022 and 2023.
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Bibliography
2023
Proceedings of the 2023 International Symposium on Physical Design, 2023
2022
An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022