Shawn Hung

According to our database, Shawn Hung authored at least 4 papers between 2020 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

System technology co-optimization and design challenges for 3D IC.

Supreet Jeloka, Brian Cline, Shidhartha Das, Benoit Labbe, Alejandro Rico, Rainer Herberholz, Javier A. DeLaCruz, Rahul Mathur, Shawn Hung

Proceedings of the IEEE Custom Integrated Circuits Conference, 2022

2021

Applying IEEE Std 1838 to the 3DIC Design Trishul - A Case Study.

Teresa L. McLaurin, Frank Frederick, Heath Perry, Shawn Hung, Saurabh Sinha

Proceedings of the 26th IEEE European Test Symposium, 2021

3D-Split SRAM: Enabling Generational Gains in Advanced CMOS.

Rahul Mathur, Mudit Bhargava, Heath Perry, Alberto Cestero, Frank Frederick, Shawn Hung, Chien-Ju Chao, Daniel Smith, Daniel Fisher, Norman Robson, Xiaoqing Xu, Pranavi Chandupatla, Raguram Balachandran, Saurabh Sinha, Brian Cline, Jaydeep P. Kulkarni

Proceedings of the IEEE Custom Integrated Circuits Conference, 2021

2020

Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology.

Rahul Mathur, Chien-Ju Chao, Rossana Liu, Nikhil Tadepalli, Pranavi Chandupatla, Shawn Hung, Xiaoqing Xu, Saurabh Sinha, Jaydeep Kulkarni

CoRR, 2020