Shanshan Cai

According to our database1, Shanshan Cai authored at least 12 papers between 2013 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2024
Evaluating the efficacy of MEANGS for mitochondrial genome assembly of cartilaginous and ray-finned fish species.
Briefings Bioinform., January, 2024

2023
How do different Industry 4.0 technologies support certain Circular Economy practices?
Ind. Manag. Data Syst., 2023

Multiplexed diffused optical imaging generative adversarial network (mDOI-GAN) for sub-surface 3D imaging of tissues.
Proceedings of the Medical Imaging 2023: Computer-Aided Diagnosis, San Diego, 2023

2021
DC-GNet: Deep Mesh Relation Capturing Graph Convolution Network for 3D Human Shape Reconstruction.
Proceedings of the MM '21: ACM Multimedia Conference, Virtual Event, China, October 20, 2021

2020
Conservative Fourier pseudo-spectral schemes for general Klein-Gordon-Schrödinger equations.
Int. J. Comput. Math., 2020

2018
A Saak Transform Approach to Efficient, Scalable and Robust Handwritten Digits Recognition.
Proceedings of the 2018 Picture Coding Symposium, 2018

Enhancing CNN Incremental Learning Capability with an Expanded Network.
Proceedings of the 2018 IEEE International Conference on Multimedia and Expo, 2018

Representative Fashion Feature Extraction by Leveraging Weakly Annotated Online Resources.
Proceedings of the 2018 IEEE International Conference on Image Processing, 2018

2015
Detecting Change Dates from Dense Satellite Time Series Using a Sub-Annual Change Detection Algorithm.
Remote. Sens., 2015

2014
Optimization of speeded-up robust feature algorithm for hardware implementation.
Sci. China Inf. Sci., 2014

2013
An efficient VLSI architecture of speeded-up robust feature extraction for high resolution and high frame rate video.
Sci. China Inf. Sci., 2013

SURFEX: A 57fps 1080P resolution 220mW silicon implementation for simplified speeded-up robust feature with 65nm process.
Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 2013


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