Shang-Fu Yeh

Orcid: 0000-0003-2690-4887

According to our database1, Shang-Fu Yeh authored at least 9 papers between 2011 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2023
Random Telegraph Noise Degradation Caused by Hot Carrier Injection in a 0.8 μm-Pitch 8.3Mpixel Stacked CMOS Image Sensor.
Sensors, September, 2023

2019
Random Telegraph Noises from the Source Follower, the Photodiode Dark Current, and the Gate-Induced Sense Node Leakage in CMOS Image Sensors.
Sensors, 2019

2018
A 0.66e<sub>rms</sub><sup>-</sup> Temporal-Readout-Noise 3-D-Stacked CMOS Image Sensor With Conditional Correlated Multiple Sampling Technique.
IEEE J. Solid State Circuits, 2018

A 1.1μm-Pitch 13.5Mpixel 3D-stacked CMOS image sensor featuring 230fps full-high-definition and 514fps high-definition videos by reading 2 or 3 rows simultaneously using a column-switching matrix.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

2017
Statistical Analysis of the Random Telegraph Noise in a 1.1 μm Pixel, 8.3 MP CMOS Image Sensor Using On-Chip Time Constant Extraction Method.
Sensors, 2017

2015
A 0.66e<sup>-</sup>rms temporal-readout-noise 3D-stacked CMOS image sensor with conditional correlated multiple sampling (CCMS) technique.
Proceedings of the Symposium on VLSI Circuits, 2015

2013
A 3 Megapixel 100 Fps 2.8 µm Pixel Pitch CMOS Image Sensor Layer With Built-in Self-Test for 3D Integrated Imagers.
IEEE J. Solid State Circuits, 2013

2011
Live demonstration: The prototype of real-time image pre-processing system for satellites' remote sensing.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2011), 2011

A new CMOS image sensor readout structure for 3D integrated imagers.
Proceedings of the 2011 IEEE Custom Integrated Circuits Conference, 2011


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