Séverine Cheramy
Orcid: 0000-0002-1473-5572
According to our database1,
Séverine Cheramy
authored at least 19 papers
between 2009 and 2021.
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Bibliography
2021
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.
IEEE J. Solid State Circuits, 2021
2020
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm<sup>2</sup> Inter-Chiplet Interconnects and 156mW/mm<sup>2</sup>@ 82%-Peak-Efficiency DC-DC Converters.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
2019
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2019
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2018
A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches.
Proceedings of the 44th IEEE European Solid State Circuits Conference, 2018
2017
A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links.
IEEE J. Solid State Circuits, 2017
2016
IEEE Des. Test, 2016
8.1 A 4×4×2 homogeneous scalable 3D network-on-chip circuit with 326MFlit/s 0.66pJ/b robust and fault-tolerant asynchronous 3D links.
Proceedings of the 2016 IEEE International Solid-State Circuits Conference, 2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009