Seungman Choi

According to our database, Seungman Choi authored at least 11 papers between 2015 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments.

Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, J. Shuster-Passage, Seungman Choi, M. Gall

Proceedings of the IEEE International Reliability Physics Symposium, 2024

A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses.

J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023

Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal.

Zhuo-Jie Wu, Ping-Chuan Wang, Seungman Choi, Patrick Justison, Martin Gall, Jae Kyu Cho, Takako Hirokawa, Yusheng Bian, Thomas Houghton, Vaishnavi Karra, Dan Moy, Karen Nummy, Dave Riggs, Norman Robson, Ian Melville, Ken Giewont

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

Nickel Silicide Electromigration on Micro Ring Modulators for Silicon Photonics Technology.

Brian T. McGowan, Michal Rakowski, Seungman Choi

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Development of Bipolar Electrostatic Chuck with a Beam-Array Assembly Fabricated by Lithography.

Yuki Taoka, Kohei Kawabata, Pasomphone Hemthavy, Seungman Choi, Kunio Takahashi, Shigeki Saito

Int. J. Autom. Technol., 2022

2021

Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects.

Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall

Proceedings of the IEEE International Reliability Physics Symposium, 2021

Heuristic Evaluation for Augmentative and Alternative Communication Application: A Case Study.

Beom Young Jeong, Seungman Choi, Kyudong Park

Proceedings of the International Conference on Information and Communication Technology Convergence, 2021

2019

Robust BEOL MIMCAP for Long and Controllable TDDB Lifetime.

Lili Cheng, Seungman Choi, Sean P. Ogden, Teck Jung Tang, Robert Fox

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

Reliability challenges for 2.5D/3D integration: An overview.

C. S. Premachandran, Seungman Choi, Salvatore Cimino, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Effect of metal line width on electromigration of BEOL Cu interconnects.

Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015

Impact of electrode surface modulation on time-dependent dielectric breakdown.

Kong Boon Yeap, Tian Shen, Galor Wenyi Zhang, Sing Fui Yap, Brian Holt, Arfa Gondal, Seungman Choi, San Leong Liew, Walter Yao, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2015