Seungjun Noh

According to our database, Seungjun Noh authored at least 2 papers in 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Large-area die-attachment by silver stress migration bonding for power device applications.

Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li, Katsuaki Suganuma

Microelectron. Reliab., 2018

Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver.

Chanyang Choe, Seungjun Noh, Chuantong Chen, Dongjin Kim, Katsuaki Suganuma

Microelectron. Reliab., 2018