Seung Wook Yoon

According to our database, Seung Wook Yoon authored at least 2 papers in 2009.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2009

3D TSV processes and its assembly/packaging technology.

Seung Wook Yoon, Dae Wook Yang, Jae Hoon Koo, Meenakshi Padmanathan, Flynn Carson

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Fabrication and packaging of microbump interconnections for 3D TSV.

Seung Wook Yoon, Jae Hoon Ku, Nathapong Suthiwongsunthorn, Pandi Chelvam Marimuthu, Flynn Carson

Proceedings of the IEEE International Conference on 3D System Integration, 2009