Seung Ho Shin

Orcid: 0009-0002-1153-0034

According to our database1, Seung Ho Shin authored at least 11 papers between 2021 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2024
GRAP: Efficient GPU-Based Redundancy Analysis Using Parallel Evaluation for Cross Faults.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., August, 2024

Effective Data-Width Aware ECC Scheme for HBM.
Proceedings of the 21st International SoC Design Conference, 2024

2023
TRUST: Through-Silicon via Repair Using Switch Matrix Topology.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2023

GPU-Based Redundancy Analysis using Partitioning Method for Memory Repair.
Proceedings of the 20th International SoC Design Conference, 2023

Redundancy Analysis Simplification Scheme for High-Speed Memory Repair.
Proceedings of the 20th International SoC Design Conference, 2023

2022
ECMO: ECC Architecture Reusing Content-Addressable Memories for Obtaining High Reliability in DRAM.
IEEE Trans. Very Large Scale Integr. Syst., 2022

An Improved Early Termination Methodology Using Convolutional Neural Network.
Proceedings of the 19th International SoC Design Conference, 2022

FAME: Fault Address Memory Structure for Repair Time Reduction.
Proceedings of the 19th International SoC Design Conference, 2022

PROG: Per-Row Output Generator for BOST.
Proceedings of the 19th International SoC Design Conference, 2022

2021
Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory.
Proceedings of the 18th International SoC Design Conference, 2021

An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA.
Proceedings of the 18th International SoC Design Conference, 2021


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