Seung-Boo Jung
According to our database1,
Seung-Boo Jung
authored at least 12 papers
between 2006 and 2016.
Collaborative distances:
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Bibliography
2016
Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications.
Microelectron. Reliab., 2016
2014
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions.
Microelectron. Reliab., 2014
2013
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test.
Microelectron. Reliab., 2013
2008
Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint.
Microelectron. Reliab., 2008
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method.
Microelectron. Reliab., 2008
Effect of surface finish material on printed circuit board for electrochemical migration.
Microelectron. Reliab., 2008
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint.
Microelectron. Reliab., 2008
2007
Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging.
Microelectron. Reliab., 2007
CoRR, 2007
Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package
CoRR, 2007
2006
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging.
Microelectron. Reliab., 2006
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application.
Microelectron. Reliab., 2006