Sergey Y. Shumarayev
According to our database1,
Sergey Y. Shumarayev
authored at least 17 papers
between 2002 and 2024.
Collaborative distances:
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Bibliography
2024
Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration.
IEEE J. Solid State Circuits, April, 2024
Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2024
2023
Arvon: A Heterogeneous SiP Integrating a 14nm FPGA and Two 22nm 1.8TFLOPS/W DSPs with 1.7Tbps/mm<sup>2</sup> AIB 2.0 Interface to Provide Versatile Workload Acceleration.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2022
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
Heterogenous Integration Enables FPGA Based Hardware Acceleration for RF Applications.
Proceedings of the 2022 IEEE Hot Chips 34 Symposium, 2022
2021
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021
2020
IEEE Micro, 2020
2018
In-Package Domain-Specific ASICs for Intel® Stratix® 10 FPGAs: A Case Study of Accelerating Deep Learning Using TensorTile ASIC.
Proceedings of the 28th International Conference on Field Programmable Logic and Applications, 2018
In-Package Domain-Specific ASICs for Intel® Stratix® 10 FPGAs: A Case Study of Accelerating Deep Learning Using TensorTile ASIC(Abstract Only).
Proceedings of the 2018 ACM/SIGDA International Symposium on Field-Programmable Gate Arrays, 2018
2015
Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015
2013
A 3.1mW phase-tunable quadrature-generation method for CEI 28G short-reach CDR in 28nm CMOS.
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013
2012
On-die instrumentation to solve challenges for 28nm, 28Gbps timing variability and stressing.
Proceedings of the 2012 IEEE International Test Conference, 2012
2010
Proceedings of the 2010 IEEE Hot Chips 22 Symposium, Stanford, CA, USA, August 22-24, 2010, 2010
2009
Emerging standards at ∼10 Gbps for wireline communications and associated integrated circuit design and validation.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2009
2007
Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, 2007
2005
Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005
2002
Proceedings of the ACM/SIGDA International Symposium on Field Programmable Gate Arrays, 2002