Seonsik Kim

According to our database1, Seonsik Kim authored at least 2 papers between 2012 and 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2013
Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global-local modeling technique.
Microelectron. Reliab., 2013

2012
Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitation.
Microelectron. Reliab., 2012


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