SeongSoo Kim

According to our database, SeongSoo Kim authored at least 3 papers between 2017 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

The Method to Measure Si Thickness for Bond Line Thickness.

YangSub Park, KilBum Kang, Sang-Yun Yun, SeongSoo Kim

Proceedings of the 7th International Conference on Pattern Recognition Applications and Methods, 2018

A Defect Inspection Method for Machine Vision Using Defect Probability Image with Deep Convolutional Neural Network.

Chanhee Jang, Sang-Yun Yun, Hyejin Hwang, Hyunmin Shin, SeongSoo Kim, YangSub Park

Proceedings of the Computer Vision - ACCV 2018, 2018

2017

A Visual Inspection Method Based on Periodic Feature for Wheel Mark Defect on Wafer Backside.

YangSub Park, KilBum Kang, SeongSoo Kim

Proceedings of the Computer Analysis of Images and Patterns, 2017