Seongmin Lee
Orcid: 0000-0002-1564-5077Affiliations:
- Yonsei University, Electrical and Electronic Department, Seoul, South Korea
According to our database1,
Seongmin Lee
authored at least 21 papers
between 2019 and 2024.
Collaborative distances:
Collaborative distances:
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Bibliography
2024
Proceedings of the Thirty-Third International Joint Conference on Artificial Intelligence, 2024
Proceedings of the Thirty-Third International Joint Conference on Artificial Intelligence, 2024
Proceedings of the IEEE International Conference on Acoustics, 2024
2023
J. Multim. Inf. Syst., June, 2023
Proceedings of the 25th IEEE International Workshop on Multimedia Signal Processing, 2023
FaceClone: Interactive Facial Shape and Motion Cloning System Using Multi-View Images.
Proceedings of the IEEE International Conference on Multimedia and Expo Workshops, 2023
Proceedings of the IEEE International Conference on Image Processing, 2023
2022
IEEE Trans. Syst. Man Cybern. Syst., 2022
IEEE Trans. Circuits Syst. Video Technol., 2022
Sensors, 2022
Technical Consideration towards Robust 3D Reconstruction with Multi-View Active Stereo Sensors.
Sensors, 2022
2021
Proceedings of the 23rd International Workshop on Multimedia Signal Processing, 2021
Proceedings of the IEEE International Conference on Signal and Image Processing Applications, 2021
Proceedings of the IEEE International Conference on Signal and Image Processing Applications, 2021
Proceedings of the 2021 IEEE International Conference on Image Processing, 2021
Checkerboard Corner Localization Accelerated with Deep False Detection for Multi-camera Calibration.
Proceedings of the Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, 2021
2020
Proceedings of the 41st Annual Conference of the European Association for Computer Graphics, 2020
Proceedings of the Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, 2020
2019
A Deep Cybersickness Predictor Based on Brain Signal Analysis for Virtual Reality Contents.
Proceedings of the 2019 IEEE/CVF International Conference on Computer Vision, 2019
Proceedings of the 2019 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, 2019
Physical parameter prediction by embedding human perceptual parameter for 3D garment modeling.
Proceedings of the 2019 Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, 2019