Seok Hwan Moon

According to our database, Seok Hwan Moon authored at least 3 papers between 2002 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration.

Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2004

Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon.

Seok Hwan Moon, Gunn Hwang, Sang Choon Ko, Youn Tae Kim

Microelectron. Reliab., 2004

2002

Improving thermal performance of miniature heat pipe for notebook PC cooling.

Seok Hwan Moon, Gunn Hwang, Ho Gyeong Yun, Tae Goo Choy, Young I. I. Kang

Microelectron. Reliab., 2002