Sejang Oh

According to our database, Sejang Oh authored at least 3 papers between 2009 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2011

Off-Chip Skew Measurement and Compensation Module (SMCM) Design for Built-Off Test Chip.

Kihyuk Han, Joonsung Park, Jae Wook Lee, Jaeyong Chung, Eonjo Byun, Cheol-Jong Woo, Sejang Oh, Jacob A. Abraham

J. Electron. Test., 2011

2010

At-speed Test of High-Speed DUT Using Built-Off Test Interface.

Joonsung Park, Jae Wook Lee, Jaeyong Chung, Kihyuk Han, Jacob A. Abraham, Eonjo Byun, Cheol-Jong Woo, Sejang Oh

Proceedings of the 19th IEEE Asian Test Symposium, 2010

2009

Low-Complexity Off-Chip Skew Measurement and Compensation Module (SMCM) Design for Built-Off Test Chip.

Kihyuk Han, Joonsung Park, Jae Wook Lee, Jacob A. Abraham, Eonjo Byun, Cheol-Jong Woo, Sejang Oh

Proceedings of the 14th IEEE European Test Symposium, 2009