Sehoon Yoo
According to our database1,
Sehoon Yoo
authored at least 6 papers
between 2011 and 2022.
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Bibliography
2022
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
2020
A 1280×960 Dynamic Vision Sensor with a 4.95-μm Pixel Pitch and Motion Artifact Minimization.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2020
2017
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications.
Microelectron. Reliab., 2017
2012
Proceedings of the International SoC Design Conference, 2012
2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011