Se Young Yang
According to our database1,
Se Young Yang
authored at least 3 papers
between 2006 and 2012.
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Bibliography
2012
Microelectron. Reliab., 2012
2006
Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition.
Microelectron. Reliab., 2006
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages.
Microelectron. Reliab., 2006