Se Young Yang

According to our database1, Se Young Yang authored at least 3 papers between 2006 and 2012.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of six.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2012
Chip warpage model for reliability prediction of delamination failures.
Microelectron. Reliab., 2012

2006
Structural reliability assessment of multi-stack package (MSP) under high temperature storage (HTS) testing condition.
Microelectron. Reliab., 2006

Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages.
Microelectron. Reliab., 2006


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