Satish Bonam

According to our database, Satish Bonam authored at least 5 papers between 2015 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Silk Piezoelectric Tactile Sensors: The Way Forward to Developing Intelligent Implantable Sensors.

Satish Bonam, Jose Joseph, Aditya Bhagavathi, Shiv Govind Singh, Siva Rama Krishna Vanjari

Proceedings of the IEEE International Symposium on Circuits and Systems, 2022

2016

Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration.

Suraj Patil, Asisa Kumar Panigrahi, Satish Bonam, C. Hemanth Kumar, Om Krishan Singh, Shiv Govind Singh

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration.

Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC.

Kumail Khurram, Asisa Kumar Panigrahi, Satish Bonam, Om Krishan Singh, Shiv Govind Singh

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding.

Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh

Proceedings of the 2015 International 3D Systems Integration Conference, 2015