Sarah Eunkyung Kim
Orcid: 0000-0001-5210-3819
According to our database1,
Sarah Eunkyung Kim
authored at least 8 papers
between 2010 and 2025.
Collaborative distances:
Collaborative distances:
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Bibliography
2025
Understanding and Optimizing Oxygen Plasma Treatment for Enhanced Cu-Cu Bonding Application.
IEEE Access, 2025
2024
First Demonstration of Enhanced Cu-Cu Bonding at Low Temperature With Ruthenium Passivation Layer.
IEEE Access, 2024
2019
Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2014
Microelectron. Reliab., 2014
2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2010
Dynamic flow measurements of capillary underfill through a bump array in flip chip package.
Microelectron. Reliab., 2010