Sankatali Venkateswarlu

Orcid: 0000-0002-1616-6764

According to our database1, Sankatali Venkateswarlu authored at least 7 papers between 2022 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2024
Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5).
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Thermal Implications in Scaling High-Performance Server 3D Chiplet-Based 2.5D SoC from FinFET to Nanosheet.
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2024

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.
IEEE Trans. Very Large Scale Integr. Syst., December, 2023

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022
Thermal Performance Analysis of Mempool RISC-V Multicore SoC.
IEEE Trans. Very Large Scale Integr. Syst., 2022


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