Sangwook Han

Orcid: 0009-0001-4246-2532

According to our database1, Sangwook Han authored at least 26 papers between 2010 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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On csauthors.net:

Bibliography

2024
Speech Emotion Recognition Incorporating Relative Difficulty and Labeling Reliability.
Sensors, July, 2024

2023
A Study of Joint Framework for Robustness Against Noise on Speaker Verification System.
Proceedings of the Fourteenth International Conference on Ubiquitous and Future Networks, 2023

Short-Segment Speaker Verification Using ECAPA-TDNN with Multi-Resolution Encoder.
Proceedings of the IEEE International Conference on Acoustics, 2023

2022
A 52MHz -158.2dBc/Hz PN @ 100kHz Digitally Controlled Crystal Oscillator Utilizing a Capacitive-Load-Dependent Dynamic Feedback Resistor in 28nm CMOS.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022

A 64Gb/s Downlink and 32Gb/s Uplink NRZ Wireline Transceiver with Supply Regulation, Background Clock Correction and EOM-based Channel Adaptation for Mid-Reach Cellular Mobile Interface in 8nm FinFET.
Proceedings of the 48th IEEE European Solid State Circuits Conference, 2022

2021
Enhancement of Coded Speech Using Neural Network-Based Side Information.
IEEE Access, 2021

Coded Speech Enhancement Using Neural Network-Based Vector-Quantized Residual Features.
Proceedings of the 22nd Annual Conference of the International Speech Communication Association, Interspeech 2021, Brno, Czechia, August 30, 2021

Time-Domain Speaker Verification Using Temporal Convolutional Networks.
Proceedings of the IEEE International Conference on Acoustics, 2021

2020
A Scalable Chatbot Platform Leveraging Online Community Posts: A Proof-of-Concept Study.
CoRR, 2020

Three-Phase-Measurement-Based Load Modeling Technique Using Unbalanced Fault Data.
IEEE Access, 2020

Selecting an Effective ESS Installation Location From the Perspective of Reactive Power.
IEEE Access, 2020

An RF Transceiver with Full Digital Interface Supporting 5G New Radio FR1 with 3.84Gbps DL/1.92Gbps UL and Dual-Band GNSS in 14nm FinFET CMOS.
Proceedings of the IEEE Symposium on VLSI Circuits, 2020

2019
A Sub-6-GHz 5G New Radio RF Transceiver Supporting EN-DC With 3.15-Gb/s DL and 1.27-Gb/s UL in 14-nm FinFET CMOS.
IEEE J. Solid State Circuits, 2019

A Sub-6GHz 5G New Radio RF Transceiver Supporting EN-DC with 3.15Gb/s DL and 1.27Gb/s UL in 14nm FinFET CMOS.
Proceedings of the IEEE International Solid- State Circuits Conference, 2019

Arrhythmia Classification System Using Deep Neural Network.
Proceedings of the Eleventh International Conference on Ubiquitous and Future Networks, 2019

Cooperative Server-Client HTTP Adaptive Streaming System for Live Video Streaming.
Proceedings of the 33rd International Conference on Information Networking, 2019

Docker-based Cloud System for Computer Programming Labs.
Proceedings of the 14th International Conference on Computer Science & Education, 2019

2018
A Two Step Multi-Carrier Proportional Fair Scheduling Scheme for Cloud Radio Access Networks.
Int. J. Interdiscip. Telecommun. Netw., 2018

2017
A 14-nm 0.14-ps<sub>rms</sub> Fractional-N Digital PLL With a 0.2-ps Resolution ADC-Assisted Coarse/Fine-Conversion Chopping TDC and TDC Nonlinearity Calibration.
IEEE J. Solid State Circuits, 2017

Implementation of a Non-Codebook Based MU-MIMO System for TDD LTE-Advanced.
Proceedings of the 85th IEEE Vehicular Technology Conference, 2017

VM Relocation Method for Increase the Resource Utilization in Cloud Computing.
Proceedings of the Advanced Multimedia and Ubiquitous Engineering, 2017

24.8 A 14nm fractional-N digital PLL with 0.14psrms jitter and -78dBc fractional spur for cellular RFICs.
Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

2014
Characterization of the Proximity Effect From Tungsten TSVs on 130-nm CMOS Devices in 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst., 2014

2013
Study of the Effectiveness of a Korean Smart Transmission Grid Based on Synchro-Phasor Data of K-WAMS.
IEEE Trans. Smart Grid, 2013

2012
0.61W/mm<sup>2</sup> resonant inductively coupled power transfer for 3D-ICs.
Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, 2012

2010
Wireless power transfer using resonant inductive coupling for 3D integrated ICs.
Proceedings of the IEEE International Conference on 3D System Integration, 2010


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