Sangki Hong

According to our database, Sangki Hong authored at least 3 papers between 2003 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

11.4 A 512Gb 3b/cell 64-stacked WL 3D V-NAND flash memory.

Chulbum Kim, Ji-Ho Cho, Woopyo Jeong, Il-Han Park, Hyun Wook Park, Doo-Hyun Kim, Daewoon Kang, Sunghoon Lee, Ji-Sang Lee, Wontae Kim, Jiyoon Park, Yang-Lo Ahn, Jiyoung Lee, Jong-Hoon Lee, Seungbum Kim, Hyun-Jun Yoon, Jaedoeg Yu, Nayoung Choi, Yelim Kwon, Nahyun Kim, Hwajun Jang, Jonghoon Park, Seunghwan Song, Yongha Park, Jinbae Bang, Sangki Hong, Byunghoon Jeong, Hyun-Jin Kim, Chunan Lee, Young-Sun Min, Inryul Lee, In-Mo Kim, Sunghoon Kim, Dongkyu Yoon, Ki-Sung Kim, Youngdon Choi, Moosung Kim, Hyunggon Kim, Pansuk Kwak, Jeong-Don Ihm, Dae-Seok Byeon, Jin-Yub Lee, Ki-Tae Park, Kyehyun Kyung

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

2016

High density backside tungsten TSV for 3D stacked ICs.

Reynard Blasa, Brian Mattis, Dave Martini, Sidi Lanee, Carl Petteway, Sangki Hong, Kangsoo Yi

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2003

Effects Of Wafer Bonding And Thinning Processes On Electrical Performance Of Mos Devices.

Wenjiang Zeng, Huamao Lin, Xiaolin Zhang, Ramasamy Chockalingam, Wee Chong Heng, Sangki Hong, Narayanan Balasubramanian

Int. J. Comput. Eng. Sci., 2003