Sandeep Kumar Samal

According to our database, Sandeep Kumar Samal authored at least 16 papers between 2013 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Entropy Production-Based Full-Chip Fatigue Analysis: From Theory to Mobile Applications.

Tianchen Wang, Sandeep Kumar Samal, Sung Kyu Lim, Yiyu Shi

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019

2018

Design and architectural co-optimization of monolithic 3D liquid state machine-based neuromorphic processor.

Bon Woong Ku, Yu Liu, Yingyezhe Jin, Sandeep Kumar Samal, Peng Li, Sung Kyu Lim

Proceedings of the 55th Annual Design Automation Conference, 2018

2017

Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs.

Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes.

Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

TSV-Based 3-D ICs: Design Methods and Tools.

Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2017

Improving Performance under Process and Voltage Variations in Near-Threshold Computing Using 3D ICs.

Sandeep Kumar Samal, Guoqing Chen, Sung Kyu Lim

ACM J. Emerg. Technol. Comput. Syst., 2017

Full chip power benefits with negative capacitance FETs.

Sandeep Kumar Samal, Sourabh Khandelwal, Asif Islam Khan, Sayeef S. Salahuddin, Chenming Hu, Sung Kyu Lim

Proceedings of the 2017 IEEE/ACM International Symposium on Low Power Electronics and Design, 2017

2016

Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs.

Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2016

Machine Learning Based Variation Modeling and Optimization for 3D ICs.

Sandeep Kumar Samal, Guoqing Chen, Sung Kyu Lim

J. Inform. and Commun. Convergence Engineering, 2016

How to Cope with Slow Transistors in the Top-tier of Monolithic 3D ICs: Design Studies and CAD Solutions.

Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim

Proceedings of the 2016 International Symposium on Low Power Electronics and Design, 2016

Tier partitioning strategy to mitigate BEOL degradation and cost issues in monolithic 3D ICs.

Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim

Proceedings of the 35th International Conference on Computer-Aided Design, 2016

2015

A Novel Entropy Production Based Full-Chip TSV Fatigue Analysis.

Tianchen Wang, Sandeep Kumar Samal, Sung Kyu Lim, Yiyu Shi

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

2014

Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs.

Shreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim

J. Inform. and Commun. Convergence Engineering, 2014

Full chip impact study of power delivery network designs in monolithic 3D ICs.

Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs.

Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim

Proceedings of the 51st Annual Design Automation Conference 2014, 2014

2013

Design and analysis of ultra low power processors using sub/near-threshold 3D stacked ICs.

Sandeep Kumar Samal, Yarui Peng, Yang Zhang, Sung Kyu Lim

Proceedings of the International Symposium on Low Power Electronics and Design (ISLPED), 2013