Samuel Riedel

Orcid: 0000-0002-5772-6377

According to our database1, Samuel Riedel authored at least 18 papers between 2020 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Enabling Efficient Hybrid Systolic Computation in Shared-L1-Memory Manycore Clusters.
IEEE Trans. Very Large Scale Integr. Syst., September, 2024

Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2024

A High-Performance, Energy-Efficient Modular DMA Engine Architecture.
IEEE Trans. Computers, January, 2024

A 1024 RV-Cores Shared-L1 Cluster with High Bandwidth Memory Link for Low-Latency 6G-SDR.
CoRR, 2024

3D Partitioning with Pipeline Optimization for Low-Latency Memory Access in Many-Core SoCs.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2024

TeraPool-SDR: An 1.89TOPS 1024 RV-Cores 4MiB Shared-L1 Cluster for Next-Generation Open-Source Software-Defined Radios.
Proceedings of the Great Lakes Symposium on VLSI 2024, 2024

LRSCwait: Enabling Scalable and Efficient Synchronization in Manycore Systems Through Polling-Free and Retry-Free Operation.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2024

2023
MemPool: A Scalable Manycore Architecture With a Low-Latency Shared L1 Memory.
IEEE Trans. Computers, December, 2023

Spatz: Clustering Compact RISC-V-Based Vector Units to Maximize Computing Efficiency.
CoRR, 2023

Fast Shared-Memory Barrier Synchronization for a 1024-Cores RISC-V Many-Core Cluster.
Proceedings of the Embedded Computer Systems: Architectures, Modeling, and Simulation, 2023

MinPool: A 16-core NUMA-L1 Memory RISC-V Processor Cluster for Always-on Image Processing in 65nm CMOS.
Proceedings of the 30th IEEE International Conference on Electronics, Circuits and Systems, 2023

MemPool Meets Systolic: Flexible Systolic Computation in a Large Shared-Memory Processor Cluster.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2023

2022
Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs.
Proceedings of the ISLPED '22: ACM/IEEE International Symposium on Low Power Electronics and Design, Boston, MA, USA, August 1, 2022

Spatz: A Compact Vector Processing Unit for High-Performance and Energy-Efficient Shared-L1 Clusters.
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022

MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration.
Proceedings of the 2022 Design, Automation & Test in Europe Conference & Exhibition, 2022

2021
Banshee: A Fast LLVM-Based RISC-V Binary Translator.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2021

MemPool: A Shared-L1 Memory Many-Core Cluster with a Low-Latency Interconnect.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2021

2020
ATUNs: Modular and Scalable Support for Atomic Operations in a Shared Memory Multiprocessor.
Proceedings of the 57th ACM/IEEE Design Automation Conference, 2020


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