Samson Melamed

According to our database, Samson Melamed authored at least 14 papers between 2006 and 2017.

Collaborative distances:

• Dijkstra number of three.
• Erdős number of four.

2017

Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits.

Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi

Microelectron. Reliab., 2017

2016

Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits.

Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi

Microelectron. Reliab., 2016

2015

Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit.

Samson Melamed, Fumito Imura, Hiroshi Nakagawa, Katsuya Kikuchi, Michiya Hagimoto, Yukoh Matsumoto, Masahiro Aoyagi

Microelectron. J., 2015

Investigation of effects of metalization on heat spreading in bump-bonded 3D systems.

Samson Melamed, Katsuya Kikuchi, Masahiro Aoyagi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2012

Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring.

Samson Melamed, Thorlindur Thorolfsson, T. Robert Harris, Shivam Priyadarshi, Paul D. Franzon, Michael B. Steer, W. Rhett Davis

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012

Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels.

Shivam Priyadarshi, T. Robert Harris, Samson Melamed, Carlos Tadeo Ortega Otero, Nikhil Kriplani, Carlos E. Christoffersen, Rajit Manohar, Steven R. Dooley, W. Rhett Davis, Paul D. Franzon, Michael B. Steer

IET Circuits Devices Syst., 2012

2011

3D specific systems design and CAD.

Paul D. Franzon, W. Rhett Davis, Thorlindur Thorolfsson, Samson Melamed

Proceedings of the 2011 International Conference on Embedded Computer Systems: Architectures, 2011

Pathfinder 3D: A flow for system-level design space exploration.

Shivam Priyadarshi, Jianchen Hu, Won Ha Choi, Samson Melamed, Xi Chen, W. Rhett Davis, Paul D. Franzon

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration.

Thorlindur Thorolfsson, Samson Melamed, W. Rhett Davis, Paul D. Franzon

ACM Trans. Design Autom. Electr. Syst., 2010

2009

Comparative analysis of two 3D integration implementations of a SAR processor.

Thorlindur Thorolfsson, Samson Melamed, Gary Charles, Paul D. Franzon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Junction-level thermal extraction and simulation of 3DICs.

Samson Melamed, Thorlindur Thorolfsson, Adi Srinivasan, Edmund Cheng, Paul D. Franzon, William Rhett Davis

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2008

Design and CAD for 3D integrated circuits.

Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller

Proceedings of the 45th Design Automation Conference, 2008

Inter-die signaling in three dimensional integrated circuits.

Christopher Mineo, Ravi Jenkal, Samson Melamed, W. Rhett Davis

Proceedings of the IEEE 2008 Custom Integrated Circuits Conference, 2008

2006

Exploring compromises among timing, power and temperature in three-dimensional integrated circuits.

Hao Hua, Christopher Mineo, Kory Schoenfliess, Ambarish M. Sule, Samson Melamed, Ravi Jenkal, W. Rhett Davis

Proceedings of the 43rd Design Automation Conference, 2006