Sam Yang

According to our database, Sam Yang authored at least 9 papers between 2005 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Electronic packaging cabinets simplified modeling, simulation, and experimental validation for systems engineering.

José V. C. Vargas, Sam Yang, Juan Carlos Ordonez, Luiz F. Rigatti, Pedro H. R. Peixoto, Wellington Balmant, Andre B. Mariano

Simul., 2022

Multi-fidelity power flow solver.

Sam Yang, Bjorn Vaagensmith, Deepika Patra, Ryan Hruska, Tyler Phillips

CoRR, 2022

MLPro: A System for Hosting Crowdsourced Machine Learning Challenges for Open-Ended Research Problems.

Peter Washington, Aayush Nandkeolyar, Sam Yang

CoRR, 2022

2021

Understanding Mobile GUI: from Pixel-Words to Screen-Sentences.

Jingwen Fu, Xiaoyi Zhang, Yuwang Wang, Wenjun Zeng, Sam Yang, Grayson Hilliard

CoRR, 2021

2019

Analog/Mixed-Signal Design Challenges in 7-nm CMOS and Beyond.

Alvin Leng Sun Loke, Da Yang, Tin Tin Wee, Jonathan L. Holland, Patrick Isakanian, Kern Rim, Sam Yang, Jacob S. Schneider, Giri Nallapati, Sreeker Dundigal, Hasnain Lakdawala, Behnam Amelifard, Chulkyu Lee, Betty McGovern, Paul S. Holdaway, Xiaohua Kong, Burton M. Leary

Proceedings of the IEEE Custom Integrated Circuits Conference, 2019

2016

Mathematical formulation and demonstration of a dynamic system-level ship thermal management tool.

Sam Yang, Juan Carlos Ordonez, José V. C. Vargas, Julie S. Chalfant, Chrys Chryssostomidis

Adv. Eng. Softw., 2016

2015

Volume element model mesh generation strategy and its application in ship thermal analysis.

Sam Yang, Emerson Dilay, Juan Carlos Ordonez, José V. C. Vargas, Julie S. Chalfant

Adv. Eng. Softw., 2015

2012

A Molecular Dynamics-Continuum Coupled Model for Heat Transfer in Composite Materials.

Jizu Huang, Liqun Cao, Sam Yang

Multiscale Model. Simul., 2012

2005

Strain for CMOS performance improvement.

Victor Chan, Ken Rim, Meikei Ieong, Sam Yang, Rajeev Malik, Young Way Teh, Min Yang, Qiqing Ouyang

Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005