S. W. Ricky Lee

Orcid: 0000-0002-7706-522X

According to our database1, S. W. Ricky Lee authored at least 7 papers between 2009 and 2025.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

2010
2012
2014
2016
2018
2020
2022
2024
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Legend:

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Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2025
An Integrated Capacitance-Pressure-Temperature Sensing Probe for Injection Molding Monitoring.
IEEE Trans. Instrum. Meas., 2025

2016
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints.
Microelectron. Reliab., 2016

2014
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints.
Microelectron. Reliab., 2014

2012
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches.
Microelectron. Reliab., 2012

Reliability of high-power LED packaging and assembly.
Microelectron. Reliab., 2012

2011
Investigation on copper diffusion depth in copper wire bonding.
Microelectron. Reliab., 2011

2009
Experimental investigations and model study of moisture behaviors in polymeric materials.
Microelectron. Reliab., 2009


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