S. W. Ricky Lee
Orcid: 0000-0002-7706-522X
According to our database1,
S. W. Ricky Lee
authored at least 7 papers
between 2009 and 2025.
Collaborative distances:
Collaborative distances:
Timeline
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Bibliography
2025
An Integrated Capacitance-Pressure-Temperature Sensing Probe for Injection Molding Monitoring.
IEEE Trans. Instrum. Meas., 2025
2016
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints.
Microelectron. Reliab., 2016
2014
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints.
Microelectron. Reliab., 2014
2012
Microelectron. Reliab., 2012
2011
Microelectron. Reliab., 2011
2009
Experimental investigations and model study of moisture behaviors in polymeric materials.
Microelectron. Reliab., 2009