S. Nurmi

According to our database, S. Nurmi authored at least 2 papers between 2002 and 2004.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2004

The effect of solder paste composition on the reliability of SnAgCu joints.

S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö

Microelectron. Reliab., 2004

2002

Impact of component placement in solder joint reliability.

T. Alander, S. Nurmi, Pekka Heino, Eero Ristolainen

Microelectron. Reliab., 2002