S. Nishizawa

According to our database, S. Nishizawa authored at least 1 paper in 2013.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2013

Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.

S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013