S. Gao
This page is a disambiguation page, it actually contains mutiple papers from persons of the same or a similar name.
Bibliography
2022
IEEE Geosci. Remote. Sens. Lett., 2022
2021
Frontiers Artif. Intell., 2021
2014
Merging pedagogical approaches: University of Glasgow-UESTC joint education programme in electronics and electrical engineering.
Proceedings of the IEEE Frontiers in Education Conference, 2014
2011
Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV).
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011