S. B. Clendenning

According to our database, S. B. Clendenning authored at least 3 papers between 2022 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

Record Performance in GAA 2D NMOS and PMOS Using Monolayer MoS2 and WSe2 with Scaled Contact and Gate Length.

W. Mortelmans, P. Buragohain, C. Rogan, A. Kitamura, C. J. Dorow, K. P. O'Brien, R. Ramamurthy, J. Lux, T. Zhong, S. Harlson, E. Gillispie, T. Wilson, Adedapo Oni, A. Penumatcha, M. S. Kavrik, K. Maxey, A. Kozhakhmetov, C. C. Lin, S. Lee, A. Vyatskikh, N. Arefin, P. Fischer, J. Kevek, T. Tronic, M. Metz, S. B. Clendenning, U. Avci

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2023

2D Materials in the BEOL.

C. H. Naylor, Kirby Maxey, C. Jezewski, K. P. O'Brien, A. V. Penumatcha, M. S. Kavrik, B. Agrawal, C. V. Littlefield, J. Lux, B. Barley, Justin R. Weber, A. Sen Gupta, C. J. Dorow, N. Arefin, S. King, R. Chebiam, J. Plombon, S. B. Clendenning, U. E. Avci, Mauro J. Kobrinsky, M. Metz

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2022

300 mm MOCVD 2D CMOS Materials for More (Than) Moore Scaling.

Kirby Maxey, C. H. Naylor, K. P. O'Brien, A. Penumatcha, Adedapo Oni, C. Mokhtarzadeh, C. J. Dorow, C. Rogan, B. Holybee, T. Tronic, D. Adams, N. Arefin, A. Sen Gupta, C.-C. Lin, T. Zhong, S. Lee, A. Kitamura, R. Bristol, S. B. Clendenning, U. Avci, M. Metz

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022