Ryohei Arima

According to our database, Ryohei Arima authored at least 2 papers between 2011 and 2013.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2013

Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.

S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Low temperature through-Si via fabrication using electroless deposition.

Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011