Ryan S. H. Yang

According to our database, Ryan S. H. Yang authored at least 1 paper in 2012.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2012

An automated ultrasonic inspection approach for flip chip solder joint assessment.

Ryan S. H. Yang, Derek R. Braden, Guang-Ming Zhang, David M. Harvey

Microelectron. Reliab., 2012