Ruixue Ding
Orcid: 0009-0006-8632-8032
According to our database1,
Ruixue Ding
authored at least 58 papers
between 2013 and 2024.
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Bibliography
2024
A 3.96-4.84-GHz Dual-Path Charge Pump PLL Achieving 89.7-fs<sub>rms</sub> Integrated Jitter and -250.8-dB FOM<sub>PLL</sub>.
IEEE Trans. Circuits Syst. II Express Briefs, April, 2024
A High Accuracy and Bandwidth Digital Background Calibration Technique for Timing Skew in TI-ADCs.
IEEE Trans. Circuits Syst. I Regul. Pap., March, 2024
A 4-GS/s 6-Bit Single-Channel TDC-Assisted Hybrid ADC Featuring Power Supply Variation Adaptation for Inter-Stage Gain Error.
IEEE Trans. Circuits Syst. II Express Briefs, January, 2024
A low-noise, 0.05-17.8-GHz fractional-N phase-locked loop with two parallel synchronized dual-core voltage-controlled oscillators.
Microelectron. J., 2024
An instrumentation amplifier with series switch pseudo resistor DC-servo loop realizing 0.16-Hz high-pass corner.
Microelectron. J., 2024
An auto-zeroing chopper-stabilized capacitively coupled instrumentation amplifier with 25-Vpp common-mode interference tolerance.
Microelectron. J., 2024
Power-efficient 12-bit 800 MS/s voltage-time hybrid domain ADC with split TDC in 28 nm CMOS.
Microelectron. J., 2024
Microelectron. J., 2024
Let LLMs Take on the Latest Challenges! A Chinese Dynamic Question Answering Benchmark.
CoRR, 2024
Geo-Encoder: A Chunk-Argument Bi-Encoder Framework for Chinese Geographic Re-Ranking.
Proceedings of the 18th Conference of the European Chapter of the Association for Computational Linguistics, 2024
Proceedings of the 6th IEEE International Conference on AI Circuits and Systems, 2024
2023
An 8-bit 1.5-GS/s Voltage-Time Hybrid Two-Step ADC With Cross-Coupled Linearized VTC.
IEEE Trans. Very Large Scale Integr. Syst., December, 2023
IEEE Trans. Very Large Scale Integr. Syst., November, 2023
IEEE Trans. Circuits Syst. I Regul. Pap., January, 2023
16-Cell stackable battery monitoring and management integrated circuit for electric vehicles.
Microelectron. J., 2023
Proceedings of the 46th International ACM SIGIR Conference on Research and Development in Information Retrieval, 2023
A 12b 1.5GS/s Single-Channel Pipelined SAR ADC with a Pipelined Residue Amplification Stage.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2023
A $142.8-\mu \text{W}$ 98.1dB-SNDR Power/Bandwidth Configurable Fully Dynamic Discrete-Time Zoom ADC with Interstage Leakage Shaping.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2023
A 5GS/s 38.04dB SNDR Single-Channel TDC-Assisted Hybrid ADC with $\lambda/4$ Transmission Line Based Time Quantizer Achieving a PVT Robustness 416.6fs Time Step.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2023
Proceedings of the Thirty-Seventh AAAI Conference on Artificial Intelligence, 2023
2022
IEEE Trans. Circuits Syst. II Express Briefs, 2022
Microelectron. J., 2022
A 20 MHz Bandwidth 79 dB SNDR SAR-Assisted Noise-Shaping Pipeline ADC With Gain and Offset Calibrations.
IEEE J. Solid State Circuits, 2022
Forging Multiple Training Objectives for Pre-trained Language Models via Meta-Learning.
Proceedings of the Findings of the Association for Computational Linguistics: EMNLP 2022, 2022
2021
IEEE Trans. Very Large Scale Integr. Syst., 2021
Microelectron. J., 2021
A 32-GS/s Front-End Sampling Circuit Achieving >39 dB SNDR for Time-Interleaved ADCs in 65-nm CMOS.
J. Circuits Syst. Comput., 2021
Proceedings of the Thirty-Fifth AAAI Conference on Artificial Intelligence, 2021
2020
IEEE Trans. Circuits Syst., 2020
2019
A 10-Bit 600-MS/s Time-Interleaved SAR ADC With Interpolation-Based Timing Skew Calibration.
IEEE Trans. Circuits Syst. II Express Briefs, 2019
Energy-Efficient Switching Scheme with 93.41% Reduction in Capacitor Area for SAR ADC.
J. Circuits Syst. Comput., 2019
Proceedings of the 2019 Conference of the North American Chapter of the Association for Computational Linguistics: Human Language Technologies, 2019
Proceedings of the 57th Conference of the Association for Computational Linguistics, 2019
2018
IEEE Trans. Circuits Syst. II Express Briefs, 2018
J. Circuits Syst. Comput., 2018
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.
Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018
A Background Timing Skew Calibration Technique in Time-Interleaved ADCs With Second Order Compensation.
Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018
A 10-KS/s 625-Hz-Bandwidth 60-dB SNDR Noise-Shaping ADC for Bio-potential Signals Detection Application.
Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018
Event Extraction with Deep Contextualized Word Representation and Multi-attention Layer.
Proceedings of the Advanced Data Mining and Applications - 14th International Conference, 2018
2017
A low-noise programmable gain amplifier with fully balanced differential difference amplifier and class-AB output stage.
Microelectron. J., 2017
2016
Microelectron. J., 2016
Analysis of propagation delay and repeater insertion in single-walled carbon nanotube bundle interconnects.
Microelectron. J., 2016
2015
A 6-to-10-Bit 0.5 V-to-0.9 V Reconfigurable 2 MS/s Power Scalable SAR ADC in 0.18 µm CMOS.
IEEE Trans. Circuits Syst. I Regul. Pap., 2015
A 10-bit 300-MS/s asynchronous SAR ADC with strategy of optimizing settling time for capacitive DAC in 65 nm CMOS.
Microelectron. J., 2015
Strategy for SAR ADC with 87.5% area saving and 99.4% switching energy reduction over conventional approach.
IEICE Electron. Express, 2015
2014
Microelectron. J., 2014
Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.
IEICE Electron. Express, 2014
2013
Thermo-mechanical performance of Cu and SiO<sub>2</sub> filled coaxial through-silicon-via (TSV).
IEICE Electron. Express, 2013
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV).
IEICE Electron. Express, 2013
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.
IEICE Electron. Express, 2013