Rüdiger Quay

Orcid: 0000-0002-3003-0134

According to our database1, Rüdiger Quay authored at least 24 papers between 2001 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
32.5 E-band (71-to-86GHz) GaN Power Amplifier with 4.37W Output Power and 18.5% PAE for 5G Backhaul.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

Scaling of GaN FinFETs on 4 Inch Silicon Carbide from 20 to 150 Fins with Maximum Frequency of Oscillation fmax = 20.4 GHz.
Proceedings of the Device Research Conference, 2024

2023
Three-Phase Motor Inverter and Current Sensing GaN Power IC.
Sensors, July, 2023

X-Band 100-W High-Voltage GaN Internally Matched FET with Low Gain Compression.
Proceedings of the IEEE International Geoscience and Remote Sensing Symposium, 2023

Normally-off quasi-vertical GaN FinFET on SiC substrate with record small-signal current gain of $\mathrm{f}_{\mathrm{t}}=10.2$ GHz.
Proceedings of the Device Research Conference, 2023

Single-Ended Resistive Down-Converter MMICs in InGaAs mHEMT and GaN-HEMT Technologies for D-Band (110-170 GHz) Applications.
Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2023

2021
Building Blocks for GaN Power Integration.
IEEE Access, 2021

2020
Failure Analysis of 100 nm AlGaN/GaN HEMTs Stressed under On- and Off-State Stress.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2018
Comparison of reliability of 100 nm AlGaN/GaN HEMTs with T-gate and SAG-gate technology.
Microelectron. Reliab., 2018

2017
Reliability of 100 nm AlGaN/GaN HEMTs for mm-wave applications.
Microelectron. Reliab., 2017

2016
Performance of tri-gate AlGaN/GaN HEMTs.
Proceedings of the 46th European Solid-State Device Research Conference, 2016

2015
Degradation of 0.25 μm GaN HEMTs under high temperature stress test.
Microelectron. Reliab., 2015

A high-power Ka-band single-pole single-throw switch MMIC using 0.25 µm GaN on SiC.
Proceedings of the 2015 IEEE Radio and Wireless Symposium, 2015

High-voltage stress time-dependent dispersion effects in AlGaN/GaN HEMTs.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014
Influence of surface states on the voltage robustness of AlGaN/GaN HFET power devices.
Microelectron. Reliab., 2014

2011
Critical factors influencing the voltage robustness of AlGaN/GaN HEMTs.
Microelectron. Reliab., 2011

Multiband Doherty RF power amplifier.
Proceedings of the AFRICON 2011, 2011

2010
Efficient AlGaN/GaN Linear and Digital-Switch-Mode Power Amplifiers for Operation at 2 GHz.
IEICE Trans. Electron., 2010

2009
Reliability and degradation mechanism of AlGaN/GaN HEMTs for next generation mobile communication systems.
Microelectron. Reliab., 2009

2006
InP DHBT-Based Monolithically Integrated CDR/DEMUX IC Operating at 80 Gbit/s.
IEEE J. Solid State Circuits, 2006

InP DHBT Based IC Technology for over 80 Gbit/s Data Communications.
IEICE Trans. Electron., 2006

2004
Reliability of 70 nm metamorphic HEMTs.
Microelectron. Reliab., 2004

2003
A 4-W X-band compact coplanar high-power amplifier MMIC with 18-dB gain and 25% PAE.
IEEE J. Solid State Circuits, 2003

2001
Industrial application of heterostructure device simulation.
IEEE J. Solid State Circuits, 2001


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