Rongmei Chen

According to our database, Rongmei Chen authored at least 17 papers between 2016 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node.

Giuliano Sisto, R. Preston, Rongmei Chen, Gioele Mirabelli, Anita Farokhnejad, Yun Zhou, Ivan Ciofi, Anne Jourdain, A. Veloso, Michele Stucchi, Odysseas Zografos, Pieter Weckx, Geert Hellings, Julien Ryckaert

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

The Promise of 2-D Materials for Scaled Digital and Analog Applications.

Devin Verreck, Piet Wambacq, Maarten Van De Put, Zubair Ahmed, Quentin Smets, Aryan Afzalian, Rutger Duflou, Xiangyu Wu, Gioele Mirabelli, Rongmei Chen, Inge Asselberghs, Gouri Sankar Kar

Proceedings of the IEEE International Solid- State Circuits Conference, 2023

A Modeling Study: Applying Carbon-Based Interconnects to BS-PDN Architecture.

Baohui Xu, Rongmei Chen, Jie Liang

Proceedings of the 15th IEEE International Conference on ASIC, 2023

Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.

Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic

Proceedings of the IEEE International 3D Systems Integration Conference, 2023

2022

Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation - Part II: CNT Interconnect Optimization.

Rongmei Chen, Lin Chen, Jie Liang, Yuanqing Cheng, Souhir Elloumi, Jaehyun Lee, Kangwei Xu, Vihar P. Georgiev, Kai Ni, Peter Debacker, Asen Asenov, Aida Todri-Sanial

IEEE Trans. Very Large Scale Integr. Syst., 2022

Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation - Part I: CNFET Transistor Optimization.

Rongmei Chen, Lin Chen, Jie Liang, Yuanqing Cheng, Souhir Elloumi, Jaehyun Lee, Kangwei Xu, Vihar P. Georgiev, Kai Ni, Peter Debacker, Asen Asenov, Aida Todri-Sanial

IEEE Trans. Very Large Scale Integr. Syst., 2022

Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails.

Anabela Veloso, Anne Jourdain, D. Radisic, Rongmei Chen, G. Arutchelvan, B. O'Sullivan, Hiroaki Arimura, Michele Stucchi, An De Keersgieter, M. Hosseini, T. Hopf, K. D'Have, S. Wang, E. Dupuy, G. Mannaert, Kevin Vandersmissen, S. Iacovo, P. Marien, S. Choudhury, F. Schleicher, F. Sebaai, Yusuke Oniki, X. Zhou, A. Gupta, Tom Schram, B. Briggs, C. Lorant, E. Rosseel, Andriy Hikavyy, Roger Loo, J. Geypen, D. Batuk, G. T. Martinez, J. P. Soulie, Katia Devriendt, B. T. Chan, S. Demuynck, Gaspard Hiblot, Geert Van der Plas, Julien Ryckaert, Gerald Beyer, E. Dentoni Litta, Eric Beyne, Naoto Horiguchi

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node.

Rongmei Chen, Giuliano Sisto, Michele Stucchi, Anne Jourdain, Kenichi Miyaguchi, Pieter Schuddinck, P. Woeltgens, H. Lin, Naveen Kakarla, Anabela Veloso, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, Geert Van der Plas, Julien Ryckaert, Eric Beyne

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper.

Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas, Eric Beyne

Proceedings of the 24th ACM/IEEE Workshop on System Level Interconnect Pathfinding, 2022

Innovations in Transistor Architecture and Device Connectivity for Advanced Logic Scaling.

Anabela Veloso, Geert Eneman, An De Keersgieter, P. Favia, Andriy Hikavyy, Rongmei Chen, Anne Jourdain, N. Horiguchi

Proceedings of the International Conference on IC Design and Technology, 2022

2021

Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited).

Giuliano Sisto, Rongmei Chen, Richard Chou, Geert Van der Plas, Eric Beyne, Rod Metcalfe, Dragomir Milojevic

Proceedings of the ACM/IEEE International Workshop on System Level Interconnect Prediction, 2021

2020

Online Cooperative Teaching Mode Based on Self-Direction Theory in Method of Sport Science Research.

Rongmei Chen, Siyuan Chen

Int. J. Emerg. Technol. Learn., 2020

2019

Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route.

Giuliano Sisto, Peter Debacker, Rongmei Chen, Geert Van der Plas, Richard Chou, Eric Beyne, Dragomir Milojevic

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Single-event multiple transients in guard-ring hardened inverter chains of different layout designs.

Wen Zhao, Chaohui He, Wei Chen, Rongmei Chen, Peitian Cong, Fengqi Zhang, Zujun Wang, Chen Shen, Lisang Zheng, Xiaoqiang Guo, Lili Ding

Microelectron. Reliab., 2018

Modeling the impact of well contacts on SEE response with bias-dependent Single-Event compact model.

Lili Ding, Wei Chen, Hongxia Guo, Tan Wang, Rongmei Chen, Yinhong Luo, Fengqi Zhang, Xiaoyu Pan

Microelectron. Reliab., 2018

2017

Improved on-chip self-triggered single-event transient measurement circuit design and applications.

Rongmei Chen, Wei Chen, Xiaoqiang Guo, Chen Shen, Fengqi Zhang, Lisang Zheng, Wen Zhao, Lili Ding, Yinhong Luo, Hongxia Guo, Yuanming Wang, Yinong Liu

Microelectron. Reliab., 2017

2016

Single-event performance of differential flip-flop designs and hardening implication.

Rongmei Chen, Enxia Zhang, Bharat L. Bhuva

Proceedings of the 22nd IEEE International Symposium on On-Line Testing and Robust System Design, 2016